10 GB
GDDR62500 MHz
Boost Clock150 W
TDP5 nm
ProcessShare on Social Media
Share Arc B570 specifications with othersTechnical Specifications
Core Specifications
Architecture:
Xe2
Process Size:
5 nm
Base Clock:
2500 MHz
Boost Clock:
2500 MHz
Shader Units:
2304
RT Cores:
18
TMUs:
144
ROPs:
80
Memory & Performance
Memory Size:
10 GB
Memory Type:
GDDR6
Memory Bandwidth:
380.0 GB/s
Bus Interface:
PCIe 4.0 x8
TDP:
150 W
Suggested PSU:
450 W
Cache & Die Information
L1 Cache:
250 KB
L2 Cache:
18.0 MB
Die Size:
272 mm²
Transistors:
19.6 billion
Transistor Density:
72.1 million/mm²
Physical Specifications
Board Length:
272 mm
Board Width:
115 mm
Power Connectors:
1x 8-pin
Display Outputs:
1x HDMI 2.1a, 3x DisplayPort 2.1
Quick Facts
Performance
Pixel Fill Rate
200.0 GPixel/s
Texture Fill Rate
360.0 GTexel/s
FP32 Performance
11.5 TFLOPS