8 GB
HBM2e1410 MHz
Boost Clock250 W
TDP7 nm
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Share CMP 170HX 8 GB specifications with othersTechnical Specifications
Core Specifications
Architecture:
Ampere
Process Size:
7 nm
Base Clock:
1140 MHz
Boost Clock:
1410 MHz
Shader Units:
4480
SMs:
70
Tensor Cores:
280
TMUs:
280
ROPs:
128
Memory & Performance
Memory Size:
8 GB
Memory Type:
HBM2e
Memory Bandwidth:
1490.0 GB/s
Bus Interface:
PCIe 1.0 x4
TDP:
250 W
Suggested PSU:
600 W
Cache & Die Information
L1 Cache:
192 KB
L2 Cache:
8.0 MB
Die Size:
826 mm²
Transistors:
54.2 billion
Transistor Density:
65.6 million/mm²
API Support
Cuda Compute
8.0 sm_80Physical Specifications
Power Connectors:
2x 8-pin
Quick Facts
Performance
Pixel Fill Rate
180.5 GPixel/s
Texture Fill Rate
394.8 GTexel/s
FP32 Performance
12.6 TFLOPS
CUDA Toolkit Compatibility
Cuda Compute
8.0
sm_80
Architecture
Ampere
Supported CUDA Toolkits
11.0
11.1
11.2
11.3
11.4
11.5
11.6
11.7
11.8
12.0
12.1
12.2
12.3
12.4
12.5
12.6
12.7
12.8
High-end Ampere architecture with Tensor Cores and Multi-Instance GPU