200 MHz

Boost Clock

180 nm

Process
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Technical Specifications

Core Specifications
Architecture: Rage 6
Process Size: 180 nm
Base Clock: 200 MHz
Boost Clock: 200 MHz
TMUs: 3
ROPs: 1
Memory & Performance
Memory Type: System Shared
Bus Interface: PCI
Cache & Die Information
Die Size: 80 mm²
Transistors: 0.0 billion
Transistor Density: 0.1 million/mm²

API Support

DirectX
6
OpenGL
1

Quick Facts

Release Date: 2007-10-18
Manufacturer: ATI
Generation: Radeon IGP(ES)

Performance

Pixel Fill Rate 0.2 GPixel/s
Texture Fill Rate 0.6 GTexel/s