131 MB
DDR500 MHz
Boost Clock46 W
TDP130 nm
ProcessShare on Social Media
Share FireGL V3200 specifications with othersTechnical Specifications
Core Specifications
Memory & Performance
Memory Size:
131 MB
Memory Type:
DDR
Memory Bandwidth:
11.2 GB/s
Bus Interface:
PCIe 1.0 x16
TDP:
46 W
Suggested PSU:
200 W
Cache & Die Information
Die Size:
92 mm²
Transistors:
0.1 billion
Transistor Density:
0.8 million/mm²
Physical Specifications
Power Connectors:
None
Quick Facts
Performance
Pixel Fill Rate
2.0 GPixel/s
Texture Fill Rate
2.0 GTexel/s