131 MB
GDDR3500 MHz
Boost Clock90 nm
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Share FireGL V3400 specifications with othersTechnical Specifications
Core Specifications
Architecture:
Ultra-Threaded SE
Process Size:
90 nm
Base Clock:
500 MHz
Boost Clock:
500 MHz
TMUs:
4
ROPs:
4
Memory & Performance
Memory Size:
131 MB
Memory Type:
GDDR3
Memory Bandwidth:
16.0 GB/s
Bus Interface:
PCIe 1.0 x16
Suggested PSU:
200 W
Cache & Die Information
Die Size:
150 mm²
Transistors:
0.2 billion
Transistor Density:
1.0 million/mm²
Physical Specifications
Power Connectors:
None
Display Outputs:
2x DVI
Quick Facts
Performance
Pixel Fill Rate
2.0 GPixel/s
Texture Fill Rate
2.0 GTexel/s