256 MB
DDR2600 MHz
Boost Clock73 W
TDP65 nm
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Share FireGL V3600 specifications with othersTechnical Specifications
Core Specifications
Architecture:
TeraScale
Process Size:
65 nm
Base Clock:
600 MHz
Boost Clock:
600 MHz
Shader Units:
120
TMUs:
8
ROPs:
4
Memory & Performance
Memory Size:
256 MB
Memory Type:
DDR2
Memory Bandwidth:
16.0 GB/s
Bus Interface:
PCIe 1.0 x16
TDP:
73 W
Suggested PSU:
250 W
Cache & Die Information
L2 Cache:
0.1 MB
Die Size:
153 mm²
Transistors:
0.4 billion
Transistor Density:
2.5 million/mm²
Physical Specifications
Power Connectors:
None
Quick Facts
Performance
Pixel Fill Rate
2.4 GPixel/s
Texture Fill Rate
4.8 GTexel/s
FP32 Performance
0.1 TFLOPS