1 GB
GDDR3600 MHz
Boost Clock111 W
TDP90 nm
ProcessShare on Social Media
Share FireGL V7350 specifications with othersTechnical Specifications
Core Specifications
Architecture:
Ultra-Threaded SE
Process Size:
90 nm
Base Clock:
600 MHz
Boost Clock:
600 MHz
TMUs:
16
ROPs:
16
Memory & Performance
Memory Size:
1 GB
Memory Type:
GDDR3
Memory Bandwidth:
41.6 GB/s
Bus Interface:
PCIe 1.0 x16
TDP:
111 W
Suggested PSU:
300 W
Cache & Die Information
Die Size:
288 mm²
Transistors:
0.3 billion
Transistor Density:
1.1 million/mm²
Physical Specifications
Board Length:
229 mm
Board Width:
111 mm
Power Connectors:
1x 6-pin
Display Outputs:
2x DVI, 1x S-Video
Quick Facts
Performance
Pixel Fill Rate
9.6 GPixel/s
Texture Fill Rate
9.6 GTexel/s