256 MB
GDDR3491 MHz
Boost Clock57 W
TDP130 nm
ProcessShare on Social Media
Share FireGL X3-256 specifications with othersTechnical Specifications
Core Specifications
Memory & Performance
Memory Size:
256 MB
Memory Type:
GDDR3
Memory Bandwidth:
29.1 GB/s
Bus Interface:
AGP 8x
TDP:
57 W
Suggested PSU:
250 W
Cache & Die Information
Die Size:
281 mm²
Transistors:
0.2 billion
Transistor Density:
0.6 million/mm²
Physical Specifications
Power Connectors:
1x Molex
Display Outputs:
2x DVI, 1x S-Video
Quick Facts
Performance
Pixel Fill Rate
5.9 GPixel/s
Texture Fill Rate
5.9 GTexel/s