256 MB
DDR2600 MHz
Boost Clock32 W
TDP90 nm
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Share FireMV 2250 PCIe x1 specifications with othersTechnical Specifications
Core Specifications
Architecture:
Ultra-Threaded SE
Process Size:
90 nm
Base Clock:
600 MHz
Boost Clock:
600 MHz
TMUs:
4
ROPs:
4
Memory & Performance
Memory Size:
256 MB
Memory Type:
DDR2
Memory Bandwidth:
12.8 GB/s
Bus Interface:
PCIe 1.0 x1
TDP:
32 W
Suggested PSU:
200 W
Cache & Die Information
Die Size:
100 mm²
Transistors:
0.1 billion
Transistor Density:
1.1 million/mm²
Physical Specifications
Board Length:
170 mm
Board Width:
69 mm
Power Connectors:
None
Display Outputs:
1x S-Video, 1x DMS-59
Quick Facts
Performance
Pixel Fill Rate
2.4 GPixel/s
Texture Fill Rate
2.4 GTexel/s