512 MB
GDDR3600 MHz
Boost Clock15 W
TDP40 nm
ProcessShare on Social Media
Share FirePro 2270 PCIe x1 specifications with othersTechnical Specifications
Core Specifications
Architecture:
TeraScale 2
Process Size:
40 nm
Base Clock:
600 MHz
Boost Clock:
600 MHz
Shader Units:
80
TMUs:
8
ROPs:
4
Memory & Performance
Memory Size:
512 MB
Memory Type:
GDDR3
Memory Bandwidth:
9.6 GB/s
Bus Interface:
PCIe 2.0 x1
TDP:
15 W
Suggested PSU:
200 W
Cache & Die Information
L1 Cache:
8 KB
L2 Cache:
0.1 MB
Die Size:
59 mm²
Transistors:
0.3 billion
Transistor Density:
4.9 million/mm²
Physical Specifications
Board Length:
170 mm
Board Width:
69 mm
Power Connectors:
None
Display Outputs:
1x DMS-59
Quick Facts
Performance
Pixel Fill Rate
2.4 GPixel/s
Texture Fill Rate
4.8 GTexel/s
FP32 Performance
0.1 TFLOPS