905 MHz
Boost Clock65 W
TDP32 nm
ProcessShare on Social Media
Share FirePro A300 specifications with othersTechnical Specifications
Core Specifications
Architecture:
TeraScale 3
Process Size:
32 nm
Base Clock:
760 MHz
Boost Clock:
905 MHz
Shader Units:
384
TMUs:
24
ROPs:
8
Memory & Performance
Memory Type:
System Shared
Bus Interface:
PCIe 2.0 x16
TDP:
65 W
Cache & Die Information
Die Size:
246 mm²
Transistors:
1.3 billion
Transistor Density:
5.3 million/mm²
Quick Facts
Performance
Pixel Fill Rate
7.2 GPixel/s
Texture Fill Rate
21.7 GTexel/s
FP32 Performance
0.7 TFLOPS