1 GB
GDDR3750 MHz
Boost Clock20 W
TDP40 nm
ProcessShare on Social Media
Share FirePro M3900 specifications with othersTechnical Specifications
Core Specifications
Architecture:
TeraScale 2
Process Size:
40 nm
Base Clock:
750 MHz
Boost Clock:
750 MHz
Shader Units:
160
TMUs:
8
ROPs:
4
Memory & Performance
Memory Size:
1 GB
Memory Type:
GDDR3
Memory Bandwidth:
14.4 GB/s
Bus Interface:
PCIe 2.0 x16
TDP:
20 W
Cache & Die Information
L1 Cache:
8 KB
L2 Cache:
0.1 MB
Die Size:
67 mm²
Transistors:
0.4 billion
Transistor Density:
5.5 million/mm²
Quick Facts
Performance
Pixel Fill Rate
3.0 GPixel/s
Texture Fill Rate
6.0 GTexel/s
FP32 Performance
0.2 TFLOPS