512 MB
GDDR3500 MHz
Boost Clock35 W
TDP55 nm
ProcessShare on Social Media
Share FirePro RG220 specifications with othersTechnical Specifications
Core Specifications
Architecture:
TeraScale
Process Size:
55 nm
Base Clock:
500 MHz
Boost Clock:
500 MHz
Shader Units:
80
TMUs:
8
ROPs:
4
Memory & Performance
Memory Size:
512 MB
Memory Type:
GDDR3
Memory Bandwidth:
51.2 GB/s
Bus Interface:
PCIe 2.0 x16
TDP:
35 W
Suggested PSU:
200 W
Cache & Die Information
Die Size:
73 mm²
Transistors:
0.2 billion
Transistor Density:
3.3 million/mm²
Physical Specifications
Board Length:
170 mm
Board Width:
111 mm
Power Connectors:
None
Display Outputs:
1x DMS-59
Quick Facts
Performance
Pixel Fill Rate
2.0 GPixel/s
Texture Fill Rate
4.0 GTexel/s
FP32 Performance
0.1 TFLOPS