512 MB
DDR3650 MHz
Boost Clock43 W
TDP40 nm
ProcessShare on Social Media
Share FirePro V3800 specifications with othersTechnical Specifications
Core Specifications
Architecture:
TeraScale 2
Process Size:
40 nm
Base Clock:
650 MHz
Boost Clock:
650 MHz
Shader Units:
400
TMUs:
20
ROPs:
8
Memory & Performance
Memory Size:
512 MB
Memory Type:
DDR3
Memory Bandwidth:
14.4 GB/s
Bus Interface:
PCIe 2.0 x16
TDP:
43 W
Suggested PSU:
200 W
Cache & Die Information
L1 Cache:
8 KB
L2 Cache:
0.1 MB
Die Size:
104 mm²
Transistors:
0.6 billion
Transistor Density:
6.0 million/mm²
Physical Specifications
Board Length:
168 mm
Board Width:
69 mm
Power Connectors:
None
Display Outputs:
1x DVI, 1x DisplayPort 1.1
Quick Facts
Performance
Pixel Fill Rate
5.2 GPixel/s
Texture Fill Rate
13.0 GTexel/s
FP32 Performance
0.5 TFLOPS