4 GB
GDDR5825 MHz
Boost Clock225 W
TDP40 nm
ProcessShare on Social Media
Share FireStream 9370 specifications with othersTechnical Specifications
Core Specifications
Architecture:
TeraScale 2
Process Size:
40 nm
Base Clock:
825 MHz
Boost Clock:
825 MHz
Shader Units:
1600
TMUs:
80
ROPs:
32
Memory & Performance
Memory Size:
4 GB
Memory Type:
GDDR5
Memory Bandwidth:
147.2 GB/s
Bus Interface:
PCIe 2.0 x16
TDP:
225 W
Suggested PSU:
550 W
Cache & Die Information
L1 Cache:
8 KB
L2 Cache:
0.5 MB
Die Size:
334 mm²
Transistors:
2.2 billion
Transistor Density:
6.4 million/mm²
Physical Specifications
Board Length:
267 mm
Board Width:
111 mm
Power Connectors:
1x 8-pin
Display Outputs:
1x DisplayPort 1.1
Quick Facts
Performance
Pixel Fill Rate
26.4 GPixel/s
Texture Fill Rate
66.0 GTexel/s
FP32 Performance
2.6 TFLOPS