512 MB
DDR2475 MHz
Boost Clock31 W
TDP40 nm
ProcessShare on Social Media
Share GeForce 210 PCI specifications with othersTechnical Specifications
Core Specifications
Architecture:
Tesla 2.0
Process Size:
40 nm
Base Clock:
475 MHz
Boost Clock:
475 MHz
Shader Units:
16
SMs:
2
TMUs:
8
ROPs:
4
Memory & Performance
Memory Size:
512 MB
Memory Type:
DDR2
Memory Bandwidth:
6.4 GB/s
Bus Interface:
PCI
TDP:
31 W
Suggested PSU:
200 W
Cache & Die Information
L2 Cache:
0.0 MB
Die Size:
100 mm²
Transistors:
0.5 billion
Transistor Density:
4.9 million/mm²
Physical Specifications
Board Length:
145 mm
Power Connectors:
None
Quick Facts
Performance
Pixel Fill Rate
1.9 GPixel/s
Texture Fill Rate
3.8 GTexel/s
FP32 Performance
0.0 TFLOPS
CUDA Toolkit Compatibility
Cuda Compute
1.2
sm_12
Architecture
Tesla
Supported CUDA Toolkits
2.0
2.1
2.2
2.3
3.0
3.1
3.2
4.0
4.1
4.2
5.0
5.5
6.0
Note: Support dropped in CUDA 6.5
Tesla architecture (G94/G96/G98/GT215/GT216/GT218) - Support dropped in CUDA 6.5