256 MB
GDDR3400 MHz
Boost Clock100 W
TDP130 nm
ProcessShare on Social Media
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Core Specifications
Memory & Performance
Memory Size:
256 MB
Memory Type:
GDDR3
Memory Bandwidth:
35.2 GB/s
Bus Interface:
AGP Pro 8x
TDP:
100 W
Suggested PSU:
300 W
Cache & Die Information
Die Size:
287 mm²
Transistors:
0.2 billion
Transistor Density:
0.8 million/mm²
Physical Specifications
Board Length:
305 mm
Power Connectors:
None
Display Outputs:
2x DVI
Quick Facts
Performance
Pixel Fill Rate
6.4 GPixel/s
Texture Fill Rate
6.4 GTexel/s