400 MHz
Boost Clock12 W
TDP80 nm
ProcessShare on Social Media
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Core Specifications
Architecture:
Tesla
Process Size:
80 nm
Base Clock:
400 MHz
Boost Clock:
400 MHz
Shader Units:
16
SMs:
2
TMUs:
4
ROPs:
4
Memory & Performance
Memory Type:
System Shared
Bus Interface:
PCIe 2.0 x16
TDP:
12 W
Cache & Die Information
Die Size:
127 mm²
Transistors:
0.2 billion
Transistor Density:
1.7 million/mm²
Quick Facts
Performance
Pixel Fill Rate
1.6 GPixel/s
Texture Fill Rate
1.6 GTexel/s
FP32 Performance
0.0 TFLOPS