500 MHz
Boost Clock40 W
TDP80 nm
ProcessShare on Social Media
Share GeForce 9100 specifications with othersTechnical Specifications
Core Specifications
Architecture:
Tesla
Process Size:
80 nm
Base Clock:
500 MHz
Boost Clock:
500 MHz
Shader Units:
16
SMs:
2
TMUs:
8
ROPs:
4
Memory & Performance
Memory Type:
System Shared
Bus Interface:
PCI
TDP:
40 W
Cache & Die Information
Die Size:
127 mm²
Transistors:
0.2 billion
Transistor Density:
1.7 million/mm²
Physical Specifications
Display Outputs:
1x DVI, 1x VGA, 1x S-Video
Quick Facts
Performance
Pixel Fill Rate
2.0 GPixel/s
Texture Fill Rate
4.0 GTexel/s
FP32 Performance
0.0 TFLOPS