256 MB
DDR475 MHz
Boost Clock74 W
TDP130 nm
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Core Specifications
Memory & Performance
Memory Size:
256 MB
Memory Type:
DDR
Memory Bandwidth:
30.4 GB/s
Bus Interface:
AGP 8x
TDP:
74 W
Suggested PSU:
250 W
Cache & Die Information
Die Size:
207 mm²
Transistors:
0.1 billion
Transistor Density:
0.7 million/mm²
Physical Specifications
Board Length:
229 mm
Board Width:
111 mm
Power Connectors:
1x Molex
Display Outputs:
1x DVI, 1x VGA, 1x S-Video
Quick Facts
Performance
Pixel Fill Rate
1.9 GPixel/s
Texture Fill Rate
3.8 GTexel/s