256 MB
GDDR3375 MHz
Boost Clock20 W
TDP90 nm
ProcessShare on Social Media
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Core Specifications
Memory & Performance
Memory Size:
256 MB
Memory Type:
GDDR3
Memory Bandwidth:
32.0 GB/s
Bus Interface:
MXM-II
TDP:
20 W
Cache & Die Information
Die Size:
196 mm²
Transistors:
0.3 billion
Transistor Density:
1.4 million/mm²
Quick Facts
Performance
Pixel Fill Rate
6.0 GPixel/s
Texture Fill Rate
7.5 GTexel/s