400 MHz
Boost Clock13 W
TDP45 nm
ProcessShare on Social Media
Share GMA 3150 specifications with othersTechnical Specifications
Core Specifications
Architecture:
Generation 4.0
Process Size:
45 nm
Base Clock:
400 MHz
Boost Clock:
400 MHz
Shader Units:
16
TMUs:
2
ROPs:
1
Memory & Performance
Memory Type:
System Shared
Bus Interface:
PCI
TDP:
13 W
Cache & Die Information
Die Size:
66 mm²
Transistors:
0.1 billion
Transistor Density:
1.9 million/mm²
Quick Facts
Performance
Pixel Fill Rate
0.4 GPixel/s
Texture Fill Rate
0.8 GTexel/s
FP32 Performance
0.0 TFLOPS