333 MHz

Boost Clock

130 nm

Process
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Technical Specifications

Core Specifications
Architecture: Generation 3.0
Process Size: 130 nm
Base Clock: 333 MHz
Boost Clock: 333 MHz
TMUs: 4
ROPs: 4
Memory & Performance
Memory Type: System Shared
Bus Interface: FSB

API Support

DirectX
9
OpenGL
1.4

Quick Facts

Release Date: 2005-01-01
Manufacturer: Intel

Performance

Pixel Fill Rate 1.3 GPixel/s
Texture Fill Rate 1.3 GTexel/s