667 MHz
Boost Clock13 W
TDP90 nm
ProcessShare on Social Media
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Core Specifications
Architecture:
Generation 4.0
Process Size:
90 nm
Base Clock:
667 MHz
Boost Clock:
667 MHz
TMUs:
8
ROPs:
1
Memory & Performance
Memory Type:
System Shared
Bus Interface:
FSB
TDP:
13 W
Quick Facts
Performance
Pixel Fill Rate
0.7 GPixel/s
Texture Fill Rate
5.3 GTexel/s