141 GB
HBM3e1785 MHz
Boost Clock600 W
TDP5 nm
ProcessShare on Social Media
Share H200 NVL specifications with othersTechnical Specifications
Core Specifications
Architecture:
Hopper
Process Size:
5 nm
Base Clock:
1365 MHz
Boost Clock:
1785 MHz
Shader Units:
16896
SMs:
132
Tensor Cores:
528
TMUs:
528
ROPs:
24
Memory & Performance
Memory Size:
141 GB
Memory Type:
HBM3e
Memory Bandwidth:
4890.0 GB/s
Bus Interface:
PCIe 5.0 x16
TDP:
600 W
Suggested PSU:
1000 W
Cache & Die Information
L1 Cache:
250 KB
L2 Cache:
50.0 MB
Die Size:
814 mm²
Transistors:
80.0 billion
Transistor Density:
98.3 million/mm²
API Support
Cuda Compute
9.0 sm_90Physical Specifications
Board Length:
267 mm
Board Width:
111 mm
Power Connectors:
8-pin EPS
Quick Facts
Performance
Pixel Fill Rate
42.8 GPixel/s
Texture Fill Rate
942.5 GTexel/s
FP32 Performance
60.3 TFLOPS
CUDA Toolkit Compatibility
Cuda Compute
9.0
sm_90
Architecture
Hopper
Supported CUDA Toolkits
11.8
12.0
12.1
12.2
12.3
12.4
12.5
12.6
12.7
12.8
Hopper architecture with Transformer Engine support for AI workloads