8 GB
LPDDR4X1100 MHz
Boost Clock300 W
TDP10 nm
ProcessShare on Social Media
Share H3C XG310 specifications with othersTechnical Specifications
Core Specifications
Architecture:
Generation 12.1
Process Size:
10 nm
Base Clock:
1050 MHz
Boost Clock:
1100 MHz
Shader Units:
768
TMUs:
48
ROPs:
24
Memory & Performance
Memory Size:
8 GB
Memory Type:
LPDDR4X
Memory Bandwidth:
68.3 GB/s
Bus Interface:
PCIe 3.0 x16
TDP:
300 W
Suggested PSU:
700 W
Cache & Die Information
L2 Cache:
1.0 MB
Die Size:
95 mm²
Physical Specifications
Power Connectors:
1x 8-pin
Quick Facts
Performance
Pixel Fill Rate
26.4 GPixel/s
Texture Fill Rate
52.8 GTexel/s
FP32 Performance
1.7 TFLOPS