1050 MHz
Boost Clock22 nm
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Core Specifications
Architecture:
Generation 7.0
Process Size:
22 nm
Base Clock:
650 MHz
Boost Clock:
1050 MHz
Shader Units:
128
TMUs:
16
ROPs:
2
Memory & Performance
Memory Type:
System Shared
Bus Interface:
Ring Bus
Cache & Die Information
Die Size:
133 mm²
Transistors:
1.2 billion
Transistor Density:
9.0 million/mm²
Quick Facts
Performance
Pixel Fill Rate
2.1 GPixel/s
Texture Fill Rate
16.8 GTexel/s
FP32 Performance
0.3 TFLOPS