1150 MHz
Boost Clock20 W
TDP22 nm
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Core Specifications
Architecture:
Generation 7.5
Process Size:
22 nm
Base Clock:
200 MHz
Boost Clock:
1150 MHz
Shader Units:
160
TMUs:
20
ROPs:
2
Memory & Performance
Memory Type:
System Shared
Bus Interface:
Ring Bus
TDP:
20 W
Quick Facts
Performance
Pixel Fill Rate
2.3 GPixel/s
Texture Fill Rate
23.0 GTexel/s
FP32 Performance
0.4 TFLOPS