850 MHz
Boost Clock5 W
TDP14 nm
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Core Specifications
Architecture:
Generation 9.5
Process Size:
14 nm
Base Clock:
300 MHz
Boost Clock:
850 MHz
Shader Units:
192
TMUs:
24
ROPs:
3
Memory & Performance
Memory Type:
System Shared
Bus Interface:
Ring Bus
TDP:
5 W
Quick Facts
Performance
Pixel Fill Rate
2.5 GPixel/s
Texture Fill Rate
20.4 GTexel/s
FP32 Performance
0.3 TFLOPS