1100 MHz
Boost Clock30 W
TDP22 nm
ProcessShare on Social Media
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Core Specifications
Architecture:
Generation 7.5
Process Size:
22 nm
Base Clock:
200 MHz
Boost Clock:
1100 MHz
Shader Units:
320
TMUs:
40
ROPs:
4
Memory & Performance
Memory Type:
System Shared
Bus Interface:
Ring Bus
TDP:
30 W
Cache & Die Information
Die Size:
181 mm²
Transistors:
1.3 billion
Transistor Density:
7.2 million/mm²
Quick Facts
Performance
Pixel Fill Rate
4.4 GPixel/s
Texture Fill Rate
44.0 GTexel/s
FP32 Performance
0.7 TFLOPS