256 MB
GDDR3680 MHz
Boost Clock30 W
TDP55 nm
ProcessShare on Social Media
Share Mobility Radeon HD 3670 specifications with othersTechnical Specifications
Core Specifications
Architecture:
TeraScale
Process Size:
55 nm
Base Clock:
680 MHz
Boost Clock:
680 MHz
Shader Units:
120
TMUs:
8
ROPs:
4
Memory & Performance
Memory Size:
256 MB
Memory Type:
GDDR3
Memory Bandwidth:
25.6 GB/s
Bus Interface:
MXM-II
TDP:
30 W
Cache & Die Information
L2 Cache:
0.1 MB
Die Size:
135 mm²
Transistors:
0.4 billion
Transistor Density:
2.8 million/mm²
Quick Facts
Performance
Pixel Fill Rate
2.7 GPixel/s
Texture Fill Rate
5.4 GTexel/s
FP32 Performance
0.2 TFLOPS