512 MB
GDDR3660 MHz
Boost Clock110 W
TDP55 nm
ProcessShare on Social Media
Share Mobility Radeon HD 3870 X2 specifications with othersTechnical Specifications
Core Specifications
Architecture:
TeraScale
Process Size:
55 nm
Base Clock:
660 MHz
Boost Clock:
660 MHz
Shader Units:
320
TMUs:
16
ROPs:
16
Memory & Performance
Memory Size:
512 MB
Memory Type:
GDDR3
Memory Bandwidth:
54.4 GB/s
Bus Interface:
PCIe 2.0 x16
TDP:
110 W
Cache & Die Information
L2 Cache:
0.2 MB
Die Size:
192 mm²
Transistors:
0.7 billion
Transistor Density:
3.5 million/mm²
Quick Facts
Performance
Pixel Fill Rate
10.6 GPixel/s
Texture Fill Rate
10.6 GTexel/s
FP32 Performance
0.4 TFLOPS