512 MB
GDDR3675 MHz
Boost Clock35 W
TDP55 nm
ProcessShare on Social Media
Share Mobility Radeon HD 4670 specifications with othersTechnical Specifications
Core Specifications
Architecture:
TeraScale
Process Size:
55 nm
Base Clock:
675 MHz
Boost Clock:
675 MHz
Shader Units:
320
TMUs:
32
ROPs:
8
Memory & Performance
Memory Size:
512 MB
Memory Type:
GDDR3
Memory Bandwidth:
25.6 GB/s
Bus Interface:
MXM-A (3.0)
TDP:
35 W
Cache & Die Information
L1 Cache:
16 KB
L2 Cache:
0.1 MB
Die Size:
146 mm²
Transistors:
0.5 billion
Transistor Density:
3.5 million/mm²
Physical Specifications
Power Connectors:
None
Quick Facts
Performance
Pixel Fill Rate
5.4 GPixel/s
Texture Fill Rate
21.6 GTexel/s
FP32 Performance
0.4 TFLOPS