2 GB
DDR31033 MHz
Boost Clock68 W
TDP28 nm
ProcessShare on Social Media
Share NVS 810 specifications with othersTechnical Specifications
Core Specifications
Architecture:
Maxwell
Process Size:
28 nm
Base Clock:
902 MHz
Boost Clock:
1033 MHz
Shader Units:
512
SMs:
4
TMUs:
32
ROPs:
16
Memory & Performance
Memory Size:
2 GB
Memory Type:
DDR3
Memory Bandwidth:
14.4 GB/s
Bus Interface:
PCIe 3.0 x16
TDP:
68 W
Suggested PSU:
250 W
Cache & Die Information
L1 Cache:
64 KB
L2 Cache:
1.0 MB
Die Size:
148 mm²
Transistors:
1.9 billion
Transistor Density:
12.6 million/mm²
Physical Specifications
Board Length:
198 mm
Power Connectors:
None
Display Outputs:
8x mini-DisplayPort 1.2
Quick Facts
Performance
Pixel Fill Rate
16.5 GPixel/s
Texture Fill Rate
33.1 GTexel/s
FP32 Performance
1.1 TFLOPS
CUDA Toolkit Compatibility
Cuda Compute
5.0
sm_50
Architecture
Maxwell 1.0
Supported CUDA Toolkits
7.0
7.5
8.0
9.0
9.1
9.2
10.0
Note: Support dropped in CUDA 10.1
Maxwell 1.0 architecture (GM107/GM108) - Support dropped in CUDA 10.1