512 MB
GDDR3575 MHz
Boost Clock45 W
TDP90 nm
ProcessShare on Social Media
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Core Specifications
Memory & Performance
Memory Size:
512 MB
Memory Type:
GDDR3
Memory Bandwidth:
38.4 GB/s
Bus Interface:
MXM-III
TDP:
45 W
Cache & Die Information
Die Size:
196 mm²
Transistors:
0.3 billion
Transistor Density:
1.4 million/mm²
Physical Specifications
Power Connectors:
None
Quick Facts
Performance
Pixel Fill Rate
9.2 GPixel/s
Texture Fill Rate
13.8 GTexel/s