256 MB
GDDR3375 MHz
Boost Clock142 W
TDP130 nm
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Core Specifications
Memory & Performance
Memory Size:
256 MB
Memory Type:
GDDR3
Memory Bandwidth:
32.0 GB/s
Bus Interface:
AGP 8x
TDP:
142 W
Suggested PSU:
300 W
Cache & Die Information
Die Size:
287 mm²
Transistors:
0.2 billion
Transistor Density:
0.8 million/mm²
Physical Specifications
Board Length:
214 mm
Board Width:
111 mm
Power Connectors:
2x Molex
Display Outputs:
2x DVI, 1x S-Video
Quick Facts
Performance
Pixel Fill Rate
6.0 GPixel/s
Texture Fill Rate
6.0 GTexel/s