131 MB
DDR300 MHz
Boost Clock25 W
TDP110 nm
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Core Specifications
Memory & Performance
Memory Size:
131 MB
Memory Type:
DDR
Memory Bandwidth:
8.0 GB/s
Bus Interface:
PCIe 1.0 x16
TDP:
25 W
Suggested PSU:
200 W
Cache & Die Information
Die Size:
154 mm²
Transistors:
0.1 billion
Transistor Density:
0.9 million/mm²
Physical Specifications
Board Length:
198 mm
Board Width:
111 mm
Power Connectors:
None
Display Outputs:
1x DVI, 1x VGA, 1x S-Video
Quick Facts
Performance
Pixel Fill Rate
1.2 GPixel/s
Texture Fill Rate
2.4 GTexel/s