350 MHz
Boost Clock65 nm
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Share Radeon 3100 Mobile IGP specifications with othersTechnical Specifications
Core Specifications
Architecture:
TeraScale
Process Size:
65 nm
Base Clock:
350 MHz
Boost Clock:
350 MHz
Shader Units:
40
TMUs:
4
ROPs:
4
Memory & Performance
Memory Type:
System Shared
Bus Interface:
PCIe 1.0 x16
Cache & Die Information
Die Size:
85 mm²
Transistors:
0.2 billion
Transistor Density:
2.1 million/mm²
Physical Specifications
Power Connectors:
None
Quick Facts
Performance
Pixel Fill Rate
1.4 GPixel/s
Texture Fill Rate
1.4 GTexel/s
FP32 Performance
0.0 TFLOPS