2 GB
GDDR51024 MHz
Boost Clock35 W
TDP28 nm
ProcessShare on Social Media
Share Radeon 625 OEM specifications with othersTechnical Specifications
Core Specifications
Architecture:
GCN 3.0
Process Size:
28 nm
Base Clock:
1024 MHz
Boost Clock:
1024 MHz
Shader Units:
384
TMUs:
24
ROPs:
8
Memory & Performance
Memory Size:
2 GB
Memory Type:
GDDR5
Memory Bandwidth:
36.0 GB/s
Bus Interface:
PCIe 3.0 x8
TDP:
35 W
Suggested PSU:
200 W
Cache & Die Information
L1 Cache:
16 KB
L2 Cache:
0.1 MB
Die Size:
125 mm²
Transistors:
1.6 billion
Transistor Density:
12.4 million/mm²
Physical Specifications
Power Connectors:
None
Quick Facts
Performance
Pixel Fill Rate
8.2 GPixel/s
Texture Fill Rate
24.6 GTexel/s
FP32 Performance
0.8 TFLOPS