512 MB
GDDR3600 MHz
Boost Clock200 W
TDP80 nm
ProcessShare on Social Media
Share Radeon HD 2900 PRO specifications with othersTechnical Specifications
Core Specifications
Architecture:
TeraScale
Process Size:
80 nm
Base Clock:
600 MHz
Boost Clock:
600 MHz
Shader Units:
320
TMUs:
16
ROPs:
16
Memory & Performance
Memory Size:
512 MB
Memory Type:
GDDR3
Memory Bandwidth:
51.2 GB/s
Bus Interface:
PCIe 1.0 x16
TDP:
200 W
Suggested PSU:
550 W
Cache & Die Information
L2 Cache:
0.1 MB
Die Size:
420 mm²
Transistors:
0.7 billion
Transistor Density:
1.7 million/mm²
Physical Specifications
Board Length:
241 mm
Power Connectors:
1x 8-pin
Display Outputs:
2x DVI, 1x S-Video
Quick Facts
Performance
Pixel Fill Rate
9.6 GPixel/s
Texture Fill Rate
9.6 GTexel/s
FP32 Performance
0.4 TFLOPS