512 MB
GDDR3668 MHz
Boost Clock75 W
TDP55 nm
ProcessShare on Social Media
Share Radeon HD 3850 AGP specifications with othersTechnical Specifications
Core Specifications
Architecture:
TeraScale
Process Size:
55 nm
Base Clock:
668 MHz
Boost Clock:
668 MHz
Shader Units:
320
TMUs:
16
ROPs:
16
Memory & Performance
Memory Size:
512 MB
Memory Type:
GDDR3
Memory Bandwidth:
53.0 GB/s
Bus Interface:
AGP 8x
TDP:
75 W
Suggested PSU:
250 W
Cache & Die Information
L2 Cache:
0.2 MB
Die Size:
192 mm²
Transistors:
0.7 billion
Transistor Density:
3.5 million/mm²
Physical Specifications
Power Connectors:
1x 8-pin
Display Outputs:
2x DVI, 1x S-Video
Quick Facts
Performance
Pixel Fill Rate
10.7 GPixel/s
Texture Fill Rate
10.7 GTexel/s
FP32 Performance
0.4 TFLOPS