512 MB
GDDR3750 MHz
Boost Clock118 W
TDP55 nm
ProcessShare on Social Media
Share Radeon HD 4670 X2 specifications with othersTechnical Specifications
Core Specifications
Architecture:
TeraScale
Process Size:
55 nm
Base Clock:
750 MHz
Boost Clock:
750 MHz
Shader Units:
320
TMUs:
32
ROPs:
8
Memory & Performance
Memory Size:
512 MB
Memory Type:
GDDR3
Memory Bandwidth:
22.4 GB/s
Bus Interface:
PCIe 2.0 x16
TDP:
118 W
Suggested PSU:
300 W
Cache & Die Information
L1 Cache:
16 KB
L2 Cache:
0.1 MB
Die Size:
146 mm²
Transistors:
0.5 billion
Transistor Density:
3.5 million/mm²
Physical Specifications
Power Connectors:
1x 6-pin
Display Outputs:
4x DVI
Quick Facts
Performance
Pixel Fill Rate
6.0 GPixel/s
Texture Fill Rate
24.0 GTexel/s
FP32 Performance
0.5 TFLOPS