1 GB
DDR3450 MHz
Boost Clock26 W
TDP40 nm
ProcessShare on Social Media
Share Radeon HD 6610M specifications with othersTechnical Specifications
Core Specifications
Architecture:
TeraScale 2
Process Size:
40 nm
Base Clock:
450 MHz
Boost Clock:
450 MHz
Shader Units:
400
TMUs:
20
ROPs:
8
Memory & Performance
Memory Size:
1 GB
Memory Type:
DDR3
Memory Bandwidth:
25.6 GB/s
Bus Interface:
PCIe 2.0 x16
TDP:
26 W
Cache & Die Information
L1 Cache:
8 KB
L2 Cache:
0.2 MB
Die Size:
118 mm²
Transistors:
0.7 billion
Transistor Density:
6.1 million/mm²
Quick Facts
Performance
Pixel Fill Rate
3.6 GPixel/s
Texture Fill Rate
9.0 GTexel/s
FP32 Performance
0.4 TFLOPS