500 MHz
Boost Clock18 W
TDP40 nm
ProcessShare on Social Media
Share Radeon HD 7310 IGP specifications with othersTechnical Specifications
Core Specifications
Architecture:
TeraScale 2
Process Size:
40 nm
Base Clock:
500 MHz
Boost Clock:
500 MHz
Shader Units:
80
TMUs:
8
ROPs:
4
Memory & Performance
Memory Type:
System Shared
Bus Interface:
IGP
TDP:
18 W
Cache & Die Information
Die Size:
75 mm²
Transistors:
0.5 billion
Transistor Density:
6.0 million/mm²
Quick Facts
Performance
Pixel Fill Rate
2.0 GPixel/s
Texture Fill Rate
4.0 GTexel/s
FP32 Performance
0.1 TFLOPS