3 GB
GDDR5925 MHz
Boost Clock200 W
TDP28 nm
ProcessShare on Social Media
Share Radeon HD 7950 Boost specifications with othersTechnical Specifications
Core Specifications
Architecture:
GCN 1.0
Process Size:
28 nm
Base Clock:
850 MHz
Boost Clock:
925 MHz
Shader Units:
1792
TMUs:
112
ROPs:
32
Memory & Performance
Memory Size:
3 GB
Memory Type:
GDDR5
Memory Bandwidth:
240.0 GB/s
Bus Interface:
PCIe 3.0 x16
TDP:
200 W
Suggested PSU:
550 W
Cache & Die Information
L1 Cache:
16 KB
L2 Cache:
0.8 MB
Die Size:
352 mm²
Transistors:
4.3 billion
Transistor Density:
12.3 million/mm²
Physical Specifications
Board Length:
275 mm
Board Width:
111 mm
Power Connectors:
2x 6-pin
Display Outputs:
1x DVI, 1x HDMI 1.4a, 2x mini-DisplayPort 1.2
Quick Facts
Performance
Pixel Fill Rate
29.6 GPixel/s
Texture Fill Rate
103.6 GTexel/s
FP32 Performance
3.3 TFLOPS