300 MHz
Boost Clock8 W
TDP28 nm
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Share Radeon HD 8210 IGP specifications with othersTechnical Specifications
Core Specifications
Architecture:
GCN 2.0
Process Size:
28 nm
Base Clock:
300 MHz
Boost Clock:
300 MHz
Shader Units:
128
TMUs:
8
ROPs:
4
Memory & Performance
Memory Type:
System Shared
Bus Interface:
IGP
TDP:
8 W
Cache & Die Information
Die Size:
110 mm²
Transistors:
1.2 billion
Transistor Density:
10.7 million/mm²
Quick Facts
Performance
Pixel Fill Rate
1.2 GPixel/s
Texture Fill Rate
2.4 GTexel/s
FP32 Performance
0.1 TFLOPS