400 MHz
Boost Clock15 W
TDP28 nm
ProcessShare on Social Media
Share Radeon HD 8240 Mobile IGP specifications with othersTechnical Specifications
Core Specifications
Architecture:
GCN 2.0
Process Size:
28 nm
Base Clock:
400 MHz
Boost Clock:
400 MHz
Shader Units:
128
TMUs:
8
ROPs:
4
Memory & Performance
Memory Type:
System Shared
Bus Interface:
IGP
TDP:
15 W
Cache & Die Information
Die Size:
110 mm²
Transistors:
1.2 billion
Transistor Density:
10.7 million/mm²
Quick Facts
Performance
Pixel Fill Rate
1.6 GPixel/s
Texture Fill Rate
3.2 GTexel/s
FP32 Performance
0.1 TFLOPS