554 MHz
Boost Clock20 W
TDP32 nm
ProcessShare on Social Media
Share Radeon HD 8310G IGP specifications with othersTechnical Specifications
Core Specifications
Architecture:
TeraScale 3
Process Size:
32 nm
Base Clock:
424 MHz
Boost Clock:
554 MHz
Shader Units:
128
TMUs:
8
ROPs:
4
Memory & Performance
Memory Type:
System Shared
Bus Interface:
IGP
TDP:
20 W
Cache & Die Information
Die Size:
246 mm²
Transistors:
1.3 billion
Transistor Density:
5.3 million/mm²
Quick Facts
Performance
Pixel Fill Rate
2.2 GPixel/s
Texture Fill Rate
4.4 GTexel/s
FP32 Performance
0.1 TFLOPS