1 GB
DDR3825 MHz
Boost Clock28 nm
ProcessShare on Social Media
Share Radeon HD 8750M specifications with othersTechnical Specifications
Core Specifications
Architecture:
GCN 1.0
Process Size:
28 nm
Base Clock:
775 MHz
Boost Clock:
825 MHz
Shader Units:
384
TMUs:
24
ROPs:
8
Memory & Performance
Memory Size:
1 GB
Memory Type:
DDR3
Memory Bandwidth:
28.8 GB/s
Bus Interface:
PCIe 3.0 x8
Cache & Die Information
L1 Cache:
16 KB
L2 Cache:
0.2 MB
Die Size:
77 mm²
Transistors:
0.9 billion
Transistor Density:
12.3 million/mm²
Quick Facts
Performance
Pixel Fill Rate
6.6 GPixel/s
Texture Fill Rate
19.8 GTexel/s
FP32 Performance
0.6 TFLOPS