1 GB
GDDR51050 MHz
Boost Clock85 W
TDP28 nm
ProcessShare on Social Media
Share Radeon HD 8770 OEM specifications with othersTechnical Specifications
Core Specifications
Architecture:
GCN 2.0
Process Size:
28 nm
Base Clock:
1050 MHz
Boost Clock:
1050 MHz
Shader Units:
896
TMUs:
56
ROPs:
16
Memory & Performance
Memory Size:
1 GB
Memory Type:
GDDR5
Memory Bandwidth:
96.0 GB/s
Bus Interface:
PCIe 3.0 x16
TDP:
85 W
Suggested PSU:
250 W
Cache & Die Information
L1 Cache:
16 KB
L2 Cache:
0.2 MB
Die Size:
160 mm²
Transistors:
2.1 billion
Transistor Density:
13.0 million/mm²
Physical Specifications
Board Length:
183 mm
Power Connectors:
1x 6-pin
Display Outputs:
1x DVI, 1x HDMI 1.4a, 2x mini-DisplayPort 1.2
Quick Facts
Performance
Pixel Fill Rate
16.8 GPixel/s
Texture Fill Rate
58.8 GTexel/s
FP32 Performance
1.9 TFLOPS